Re: [Tccc] CFP: EmbeddedCom-09 Call For Papers (Dalian, China, September 25-27, 2009)

>
> *** We apologize if you receive multiple copies of this CFP ***
>
> EmbeddedCom-09 Call For Papers
> The 8th IEEE International Conference on Embedded Computing
> (EmbeddedCom-09)
>
> Dalian, China, September 25-27, 2009,
>
> http://cnhpc.dlut.edu.cn/SEC09/
>
> Organized by Dalian University of Technology, China
> Sponsored by IEEE, IEEE CS, IEEE TCSC, and NSFC
>
>
> EmbeddedCom-09 is the next event, in a series of highly successful
> International Conferences on
> Embedded Computing,(EmbeddedCom), previously held as ICPP--NEC04(Montreal,
> Canada, August
> 2004), ICPP-EC05 (Oslo, Norway, June 2005), ICPADS-PDES05 (Fukuoka, Japan,
> July 2005),
> ICPP-EC06 (Columbus, USA, August 2006), SEC-07 (Niagara Falls, Canada, May
> 2007),
> ICPP-EPDC07(Xian, China, September, 2007) and SEC-08 (Beijing, China,
> October 2008).
>
> SCOPE AND INTERESTS
>
> o Embedded Hardware Support
> o Hardware/Software Co-design
> o Power and Energy-aware Computing
> o Real-time Systems
> o Cyber-Physical Systems
> o Embedded Software Development and Optimizations
> o Supporting Technologies: SoC, FPGA, etc
> o Application-specific Processors and Devices
> o Testing and Verification
> o Sensor Networks
> o Multimedia and Data Management
> o Mobile and Pervasive Computing & Communications
> o Security, Privacy, Trust, Dependability and Fault Tolerance
> o Human-Computer Interaction
> o Agents and Distributed Computing
> o Middleware and Peer-to-Peer Computing
> o Internet Computing and Applications
> o Emerging New Topics: challenges arising from new technologies (e.g.,
> nanotechnology), new applications (e.g., ubiquitous computing, embedded
> internet
> tools), new principle (e.g., embedded engineering), etc.
>
> IMPORTANT DATES
>
> Workshop Proposal: April 15, 2009
> Submission Deadline: May 01 , 2009
> Authors Notification: June 19, 2009
> Final Manuscript Due: July 13, 2009
>
> ELECTRONIC SUBMISSION
> Prepare your paper with free styles not more than 15 pages in PDF file.
> Submit your paper(s)
> at the EmbeddedCom-09 submission site:
> http://cse.stfx.ca/~embeddedcom09/sub/
> Each submission should be regarded as an undertaking that, if the paper be
> accepted, at
> least one of the authors must attend the conference to present the work in
> order for the
> paper to be included in the IEEE Digital Library.
>
> PAPER PUBLICATIONS
> Accepted papers will be published in proceedings of the EmbeddedCom-09
> conference by
> IEEE Computer Society. Selected bested papers will be recommended for
> publication in
> special issues of Journal of Embedded Computing (JEC), International
> Journal of Embedded
> Systems (IJES), and several SCI-indexed journals.
>
> WORKSHOP/SYMPOSIUM PROPOSAL
> In conjunction with the EmbeddedCom-09 conference, several workshops or
> symposia will
> be held. Please submit a workshop proposal including call for papers,
> organizing committee,
> important dates, short bio of the organizers to the EmbeddedCom-09 workshop
> chairs
> before April 15, 2009. Proceedings of EmbeddedCom-09 workshops or symposia
> will be
> published by IEEE CS Press. The workshops with more than 15 papers will be
> granted with a
> free complimentary registration for the leading workshop/symposium
> organizer.
>
>
> General Chairs
> Keqiu Li, Dalian University of Technology, China
> Masahiro Sowa, Electro-Communications Univ, Japan
> Ivan Stojmenovic, University of Ottawa, Canada
>
> Program Chairs
> Meikang Qiu, University of New Orleans, USA
> Yongxin Zhu, Shanghai Jiaotong University, China
> Nicolas Navet, INRIA Lorraine, France
>
> Workshop Chairs
> Salvatore Vitabile, University of Palermo, Italy
> Antonio Gentile, University of Palermo, Italy
> Lewis Baumstark, University of West Georgia, USA
>
> Steering Chair
> Laurence T. Yang, St Francis Xavier University, Canada
>
> Steering Committee
> Edwin H.-M. Sha, University of Texas at Dallas, USA
> Jason Xue, City University of Hong Kong, China
> Zili Shao, Hong Kong Polytechnic University, China
> Salvatore Vitabile, University of Palermo, Italy
> Antonio Gentile, University of Palermo, Italy
>
> Panel Chair
> Pao-Ann Hsiung, National Chung Cheng University, Taiwan
>
> Publication Chairs
> Yang Xiang, Central Queensland University, Australia
> Kai Lin, Dalian University of Technology, China
>
> Publicity Chairs
> Lei Shu, National University of Ireland, Ireland
> Seon Wook Kim,Korea University, Korea
> Feilong Tang, Shanghai Jiaotong University, China
> Dakai Zhu, University of Texas at San Antonio, USA
> Bing Guo, Sichuan University, China
> Senol Z. Erdogan, Maltepe University, Turkey
> Evi Syukur, University of New South Wales, Australia
>
> Local Chair
> Yanming Shen, Dalian University of Technology, China
> Registration Chairs
> Chong Yao, Dalian University of Technology, China
> Lulu Sun, Dalian University of Technology, China
> Submission Chair
> Liu Yang, St Francis Xavier University, Canada
>
> Program Committee
> See EmbeddedCom-09 web site http://cnhpc.dlut.edu.cn/sec09/
>
>
> Further questions, please contact with
> Dr. Keqiu Li, Professor
> Department of Computer Science and Engineering
> Dalian University of Technology
> No 2, Linggong Road, Dalian, 116024, China
> Email: keqiu@dlut.edu.cn
> Tel/Fax: 86-411-84709242
>
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