[Tccc] CFP: Workshop on Intelligent Structural Health Monitoring for ITSC'09

Call for Papers for

Special Session on Intelligent Structural Health and Safety Monitoring

for the 12th International IEEE Conference on Intelligent Transportation
Systems

October 4-7, 2009 in St. Louis, Missouri, U.S.A.

(Deadline: Friday, May 15)

Using advanced sensor and wireless communication technology, the health and
safety of much of today's critical infrastructure (e.g., bridges, roads,
tunnels, and buildings) can be continuously, autonomously, and remotely
monitored to streamline maintenance efforts and provide early warning of
pending hazards (e.g., structural fatigue, icing conditions, floods, and
fire). These cost-effective systems allow for long-term continuous
monitoring, instead of occasional human inspection, thus providing immediate
detection of potential problems before they become major catastrophes. This
workshop will provide an overview of ongoing research in this emerging area,
including, but not limited to, the development of intelligent sensors,
instrumentation and devices for infrastructure monitoring, wireless sensor
networks, energy harvesting systems, structure reliability analysis, and
modeling, simulation, and implementation of infrastructure monitoring
systems.

Submission Details

Complete manuscripts in PDF format must be electronically submitted for
peer-review in IEEE standard-format through the Papercept System. Write the
manuscripts using the two-column IEEE Format. The page limit is six pages. A
pdf example (http://campus.mst.edu/itsc2009/IEEEpdf%20template.pdf) and a
Word template are available
(http://campus.mst.edu/itsc2009/IEEEtemplate.doc). The link for submitting
papers through the Papercept System is
http://its.papercept.net/conferences/scripts/start.pl. The deadline for
submission is Friday, May 15.

Please refer to the conference website, http://campus.mst.edu/itsc2009/, or
contact the special session organizers below for additional information or
questions.

Organizers

Scott C. Smith and Jingxian Wu

Dept. of Electrical Engineering

University of Arkansas

smithsco@uark.edu and wuj@uark.edu

Sahra Sedigh

Dept. of Electrical & Computer Engineering

Missouri University of Science & Technology

sedighs@mst.edu

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