[Tccc] CFP: EmbeddedCom-09 Call For Papers (Dalian, China, September 25-27, 2009)

The submission deadline has been extended to May 15, 2009.

************* We apologize if you receive multiple copies of this CFP
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EmbeddedCom-09 Call For Papers
The 8th IEEE International Conference on Embedded Computing (EmbeddedCom-09)
Dalian, China, September 25-27, 2009,
http://cnhpc.dlut.edu.cn/SEC09/
Organized by Dalian University of Technology, China
Sponsored by IEEE, IEEE CS, IEEE TCSC, and NSFC
EmbeddedCom-09 is the next event, in a series of highly successful
International Conferences on
Embedded Computing,(EmbeddedCom), previously held as ICPP--NEC04(Montreal,
Canada, August
2004), ICPP-EC05 (Oslo, Norway, June 2005), ICPADS-PDES05 (Fukuoka, Japan,
July 2005),
ICPP-EC06 (Columbus, USA, August 2006), SEC-07 (Niagara Falls, Canada, May
2007),
ICPP-EPDC07(Xian, China, September, 2007) and SEC-08 (Beijing, China,
October 2008).
SCOPE AND INTERESTS
o Embedded Hardware Support
o Hardware/Software Co-design
o Power and Energy-aware Computing
o Real-time Systems
o Cyber-Physical Systems
o Embedded Software Development and Optimizations
o Supporting Technologies: SoC, FPGA, etc
o Application-specific Processors and Devices
o Testing and Verification
o Sensor Networks
o Multimedia and Data Management
o Mobile and Pervasive Computing & Communications
o Security, Privacy, Trust, Dependability and Fault Tolerance
o Human-Computer Interaction
o Agents and Distributed Computing
o Middleware and Peer-to-Peer Computing
o Internet Computing and Applications
o Emerging New Topics: challenges arising from new technologies (e.g.,
nanotechnology), new applications (e.g., ubiquitous computing, embedded
internet
tools), new principle (e.g., embedded engineering), etc.
IMPORTANT DATES
Workshop Proposal: April 15, 2009
Submission Deadline: May 15, 2009
Authors Notification: June 19, 2009
Final Manuscript Due: July 13, 2009
ELECTRONIC SUBMISSION
Prepare your paper with free styles not more than 15 pages in PDF file.
Submit your paper(s)
at the EmbeddedCom-09 submission site:
http://cse.stfx.ca/~embeddedcom09/sub/
Each submission should be regarded as an undertaking that, if the paper be
accepted, at
least one of the authors must attend the conference to present the work in
order for the
paper to be included in the IEEE Digital Library.
PAPER PUBLICATIONS
Accepted papers will be published in proceedings of the EmbeddedCom-09
conference by
IEEE Computer Society. Selected bested papers will be recommended for
publication in
special issues of Journal of Embedded Computing (JEC), International Journal
of Embedded
Systems (IJES), and several SCI-indexed journals.
WORKSHOP/SYMPOSIUM PROPOSAL
In conjunction with the EmbeddedCom-09 conference, several workshops or
symposia will
be held. Please submit a workshop proposal including call for papers,
organizing committee,
important dates, short bio of the organizers to the EmbeddedCom-09 workshop
chairs
before April 15, 2009. Proceedings of EmbeddedCom-09 workshops or symposia
will be
published by IEEE CS Press. The workshops with more than 15 papers will be
granted with a
free complimentary registration for the leading workshop/symposium
organizer.
General Chairs
Keqiu Li, Dalian University of Technology, China
Masahiro Sowa, Electro-Communications Univ, Japan
Ivan Stojmenovic, University of Ottawa, Canada
Program Chairs
Meikang Qiu, University of New Orleans, USA
Yongxin Zhu, Shanghai Jiaotong University, China
Nicolas Navet, INRIA Lorraine, France
Workshop Chairs
Salvatore Vitabile, University of Palermo, Italy
Antonio Gentile, University of Palermo, Italy
Lewis Baumstark, University of West Georgia, USA
Steering Chair
Laurence T. Yang, St Francis Xavier University, Canada
Steering Committee
Edwin H.-M. Sha, University of Texas at Dallas, USA
Jason Xue, City University of Hong Kong, China
Zili Shao, Hong Kong Polytechnic University, China
Salvatore Vitabile, University of Palermo, Italy
Antonio Gentile, University of Palermo, Italy
Panel Chair
Pao-Ann Hsiung, National Chung Cheng University, Taiwan
Publication Chairs
Yang Xiang, Central Queensland University, Australia
Kai Lin, Dalian University of Technology, China
Publicity Chairs
Lei Shu, National University of Ireland, Ireland
Seon Wook Kim,Korea University, Korea
Feilong Tang, Shanghai Jiaotong University, China
Dakai Zhu, University of Texas at San Antonio, USA
Bing Guo, Sichuan University, China
Senol Z. Erdogan, Maltepe University, Turkey
Evi Syukur, University of New South Wales, Australia
Local Chair
Yanming Shen, Dalian University of Technology, China
Registration Chairs
Chong Yao, Dalian University of Technology, China
Lulu Sun, Dalian University of Technology, China
Submission Chair
Liu Yang, St Francis Xavier University, Canada
Program Committee
See EmbeddedCom-09 web site http://cnhpc.dlut.edu.cn/sec09/
Further questions, please contact with
Dr. Keqiu Li, Professor
Department of Computer Science and Engineering
Dalian University of Technology
No 2, Linggong Road, Dalian, 116024, China
Email: keqiu@dlut.edu.cn
Tel/Fax: 86-411-84709242
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