[Tccc] Final Call for Papers - Extended deadline of IEEE TSP-09 (June 10, Firm Deadline), to be held in Macau SAR, China, October 12-14, 2009, in conjunction with IEEE MASS-09.

Final Call for Papers - Extended deadline of IEEE TSP-09 (June 10, Firm
Deadline), to be held in Macau SAR, China, October 12-14, 2009, in
conjunction with IEEE MASS-09.
---------------------------------------------------------------------------------------------
Final Call for Papers for the 2009 IEEE International Symposium
on Trust, Security and Privacy for Pervasive Applications (IEEE TSP-09)

Organizer: Trusted Computing Institute, Central South University, China

Macau SAR, China, October 12-14, 2009

http://trust.csu.edu.cn/conference/tsp2009/

To be held in conjunction with

The 2009 IEEE International Conference on Mobile Ad-hoc and Sensor Systems
(IEEE MASS 2009)

http://www.cs.cityu.edu.hk/mass09/

Introduction

Pervasive Computing (or ubiquitous computing) is a rapidly developing
research area cross various disciplines including

computer science, electronic engineering, mobile and wireless
communications, etc. The growing availability of

microprocessors with built-in communications facilities makes it possible
for people to obtain information and services

anytime and anywhere. Pervasive computing could have a range of applications
such as healthcare, homecare, intelligent

transportation, and environmental monitoring. However, it is quite difficult
for pervasive applications to satisfy trust,

security and privacy requirements, as a result of their ability to gather
sensitive data and change the environment via

actuating devices autonomously.

Following the success of TSP 2008 in Shanghai, China during December 17-20,
2008, "The 2009 IEEE International Symposium on

Trust, Security and Privacy for Pervasive Applications" (TSP-09) will be
held in Macau SAR, China during October 5-7, 2009,

in conjunction with "The 2009 IEEE International Conference on Mobile Ad-hoc
and Sensor Systems" (IEEE MASS 2009), aims at

bringing together researchers and practitioners in the world working on
trust, security, privacy, and related issues such as

technical, social and cultural implications for pervasive devices, services,
networks, applications and systems, and

providing a forum for them to present and discuss emerging ideas and trends
in this highly challenging research area.

Scope and Interests

TSP-09 is an international forum for presenting and discussing emerging
ideas and trends in trust, security and privacy for

pervasive applications from both the research community as well as the
industry. Topics of interest include, but are not

limited to:

(1) Trust, Security and Privacy (TSP) metrics and architectures for
pervasive computing
(2) Trust management in pervasive environment
(3) Risk management in pervasive environment
(4) Security and privacy protection in pervasive environment
(5) Security and privacy in mobile and wireless communications
(6) Security and privacy for databases in pervasive environment
(7) Safety and user experiences in pervasive environment
(8) TSP-aware social and cultural implications in pervasive environment
(9) Cryptographic devices for pervasive computing
(10) Biometric authentication for pervasive devices
(11) Security for embedded software and systems
(12) TSP-aware middleware design for pervasive services
(13) TSP-aware case studies on pervasive applications/systems
(14) Key management in pervasive applications/systems
(15) Authentication in pervasive applications/systems
(16) Audit and accountability in pervasive applications/systems
(17) Access control in pervasive applications/systems
(18) Anonymity in pervasive applications/systems
(19) Reliability and fault tolerance in pervasive applications/systems
(20) Miscellaneous issues in pervasive devices, services, applications, and
systems

Submission and Publication Information

The accepted papers from this symposium will be published by IEEE Computer
Society in IEEE MASS-09 symposium/workshop

proceedings (indexed by EI Compendex and ISTP). Papers should be written in
English conforming to the IEEE standard

conference format (8.5" x 11", Two-Column) [
http://www.computer.org/portal/pages/cscps/cps/cps_forms.html]. Papers
should be

submitted through the paper submission system at the symposium website

[http://trust.csu.edu.cn/conference/tsp2009/submission]. Each paper is
limited to 6 pages (or 8 pages with over length

charge). Distinguished papers, after further revisions, will be published in
a special issue of "The Journal of

Supercomputing" (Springer) to be indexed by both SCI and EI (approved). The
program committee will select one winner for the

Best Paper Award for this symposium. Submitting a paper to the symposium
means that, if the paper is accepted, at least one

author should attend the symposium and present the paper. For no-show
authors, their papers will be removed from the digital

library after the symposium and their affiliations will be notified.

---
FYI: Based on the papers published in TSP-2008 proceedings, we have
successfully applied for a Special Issue in "IEICE

Transactions on Information and Systems" (
http://www.ieice.org/eng/s_issue/cfp/2010_3ED.pdf). In this year, based on
our TSP

-2009 papers, we have successfully applied for a Special Issue in "The
Journal of Supercomputing" (Springer). Hope to get

your contributions in TSP-2009! Thank you very much for your contribution in
advance!
---

Important Dates

(1) Paper submission due: May 31, 2009 (Extended to June 10, Firm
Deadline)
(2) Notification of decision: June 30, 2009
(3) Camera-ready papers due: July 31, 2009

General Co-Chairs

Jie Li, University of Tsukuba, Japan
Geyong Min, University of Bradford, UK

Program Co-Chairs

Guojun Wang, Central South University, China
Wanlei Zhou, Deakin University, Australia

Program Committee (in alphabetical order)

Abdallah Mhamed, ITSudParis, France
Adnan Noor Mian, Sapienza, University of Rome, Italy
Atsushi Inoie, Kanagawa Institute of Technology, Japan
Baoliu Ye, Nanjing University, China
Bhavani Thuraisingham, University of Texas, USA
Chang-Ai Sun, Beijing Jiao Tong University, China
Cho-Li Wang, The University of Hong Kong, Hong Kong
Dan Wang, Hong Kong Polytechnic University, Hong Kong
Dhiah el Diehn I. Abou-Tair, University of siegen, Germany
Duminda Wijesekera, George Mason University, USA
Eduardo Fernandez-Medina, Universidad de Castilla-La Mancha
Elisa Bertino, Purdue University, USA
Fang Qi, Central South University, China
Gang Pan, Zhejiang University, China
Gregorio Martinez, University of Murcia (UMU), Spain
Guilin Wang, University of Birmingham, UK
Hai Jiang, Arkansas State University, USA
Hao Yin, Tsinghua University, China
Hiroshi Mineno, Shizuoka University, Japan
Imed Romdhani, Npier University, UK
Indrajit Ray, Colorado State University, USA
Indrakshi Ray, Colorado State University, USA
Is-Haka Mkwawa, University of Plymouth, UK
James Joshi, University of Pittsburgh, USA
Jamie Graves, Napier University, UK
Jason Crampton, Royal Holloway, University of London, UK
Gang Peng, Stony Brook University, USA
Jianming Fu, Wuhan University, China
Joon S. Park, Syracuse University, USA
Junzhao Du, Xidian University, China
Kenichi Takahashi, Institute of Systems, Information Technologies and
Nanotechnologies, Japan
Keqiu Li, Dalian University of Technology, China
Kouichi Sakurai, Kyushu University, Japan
Kun Yang, University of Essex, UK
Lizhe Wang, Rochester Institute of Technology
Luis Javier García Villalba, Complutense University of Madrid, Spain
Martin Olivier, University of Pretoria, South Africa
Mumtaz Kamala, University of Bradford, UK
Muneer Bani Yassein, Jordan University of Science and Technology, Jordan
Prashant Pillai, University of Bradford, UK
Robert C. H. Hsu, Chung Hua University, Taiwan
Robert H. Deng, Singapore Management University, Singapore
Saad Bani Mohammad, University of Al al-Bayt, Jordan
Salima Benbernou, University Claude Bernard Lyon1, France
Sanglu Lu, Nanjing University, China
Sanjay Madria, Missouri University of Science and Technology, USA
Sheika Iqbal Ahamed, Marquette University, USA
Shiguo Lian, France Telecom R&D (Orange Labs) Beijing, China
Shui Yu, Deakin University, Australia
Song Guo, The University of Aizu, Japan
Song Han, Curtin University of Technology, Australia
Steve Barker, King's College, London, UK
Sugang Xu, NICT, Japan
Tai-hoon Kim, Hannam University, Korea
Thomas Grill, Johannes Kepler University Linz, Austria
Traian Marius Truta, Northern Kentucky University, USA
Vijayalakshmi Atluri, Rutgers University, USA
W. Buchanan, Napier University, UK
Wei Peng, National University of Defense Technology, China
Willy Susilo, University of Wollongong, Australia
Xiaolong Jin, University of Bradford, UK
Yang Xiang, Central Queensland University, Australia
Yanjiang Yang, I2R, Singapore
Yi Mu, University of Wollongong, Australia
Yongdong Wu, Institute for Infocomm Research, Singapore
Yoshitaka Nakamura, NARA Institute of Science and Technology, Japan
Zhe Tang, Central South University, China
Zhen Chen, Tsinghua University, China
Zhenjiang Miao, Beijing Jiao Tong University, China
Zhiwen Yu, Northwestern Polytechnical University, China
Zonghua Zhang, NICT, Japan

Steering Co-Chairs

Laurence T. Yang, St. Francis Xavier University, Canada
Jianhua Ma, Hosei University, Japan

Publicity Co-Chairs

Ahmed Y. Al-Dubai, Napier University, UK
Mamun Abu-tair, Queen's University Belfast, UK
Peter Mueller, IBM Zurich Research Laboratory, Switzerland
Ruidong Li, National Institute of Information and Communications Technology
(NICT), Japan

Secretariat

Yueming Deng, Central South University, China

Contact

Please email inquiries concerning TSP-09 to: Prof. Guojun Wang
Email csgjwang AT gmail DOT com
Homepage http://trust.csu.edu.cn/faculty/~csgjwang/
---------------------------------------------------------------------------------------------
_______________________________________________
Tccc mailing list
Tccc@lists.cs.columbia.edu
https://lists.cs.columbia.edu/cucslists/listinfo/tccc