2009-09-24

[Tccc] CFP: Special Issue on on: Telecommunications Software Engineering: Emerging Methods, Models and Tools, MCM Journal, Elsevier Mathematical and Computer Modeling Journal (Elsevier)

Call for Papers:
Special issue on: Telecommunications Software Engineering: Emerging
Methods, Models and Tools

Telecommunications software engineering involves the application of
engineering methods in the development of telecommunications software
through the usage of systematic and disciplined qualitative and
quantitative studies. Software engineering, as such, is amongst the
younger generation engineering disciplines, which is still far from
reaching the stage of maturity. Software processes are more complex than
traditional manufacturing processes and are very poorly understood.
Telecommunication systems are very complex and the application of not so
well development software engineering processes for the development of
these systems adds to the complexity. Lots of works are undertaken
worldwide on telecommunications software engineering. As new and
attractive telecommunications technologies emerge every year, new
software
engineering methods, models and tools are required for supporting the
development and the maintenance of the increasingly complex systems.
This
Special Issue will dedicate to cataloguing excellent works on all phases
of telecommunication systems software development including
requirements,
design, development, testing, maintenance, supporting algorithms and
protocols. Telecommunication topics of interest include, but are not
limited to:

• Optical communication systems
• Cellular communication systems
• Broadband wireless access systems
• Wireless Internet
• Software defined radio
• Bluetooth technology
• Ultra-wide band radio
• Emerging Ad Hoc and Sensor Networks
• Wireless Mesh Networks
• IEEE 802.11/802.20/802.22
• Emerging issues in 3G and 4G wireless networks
• Multimedia over emerging wireless networks
• Underwater sensor networks
• Very low-powered sensors
• Cooperative wireless communications
• Multi-hop relay wireless communications
• Emerging wireless network security issues
• Wireless telemedicine and e-health

Guest Editor:
Isaac Woungang
Department of Computer Science
Ryerson University
Toronto, Ontario, Canada.
E-mail: iwoungan@scs.ryerson.ca

Submission Details:
Original, high quality contributions that are not yet published or that
are not currently under review by other journals or peer-reviewed
conferences are sought. Manuscripts should be submitted online at
http://ees.elsevier.com/mcm/. Please mention the special issue title in
the covering letter. Until this is done, the paper will not be accepted
for this Special Issue. General instructions for authors can be found at

http://www.elsevier.com/wps/find/journaldescription.cws_home/623/
description#description

Contributing authors might also be asked to review some of the papers
submitted to this special issue.

Important Dates:
Manuscript Due: October 15, 2009
Acceptance Notification: December 31, 2009.

Camera-Ready Final Manuscript Due: February 1, 2010
Publication Date (tentative): Dec. 2010


SPECIAL ISSUE REQUIREMENTS
FOR AUTHORS
Computers and Mathematics with Applications
Mathematical and Computer Modelling

In order to continue the publication of professional quality
journals, the items listed below are the minimum requirements for
accepting manuscripts for Special Issues submitted for publication in
Computers and Mathematics with Applications and Mathematical and
Computer Modelling. As a Guest Editor, we ask you to be sure the
manuscripts meet these requirements when they are submitted to us for
typesetting/formatting/publication, and advise your authors that we
shall not be able to typeset/format their manuscripts until these
requirements are fulfilled. We suggest that you use the following as
a checklist before forwarding the issue to us.
____ Title and Preface: Submit the complete formal title, Guest Editor
(s) name(s) and address(es) as they are to appear on the title page.
Remember to include with the issue manuscripts a Preface/Foreword,
and any dedication or other standard pages that are to be used.
____ Table of Contents: Submit a list of all manuscripts in the order
they are to appear in the issue. Mark the list "Table of Contents".
Make sure the corresponding author is marked for manuscripts with
more than one author. Authors should not appear as co-authors for
more than two manuscripts (excluding Preface and Dedication).
____ Addresses: Please make sure all manuscripts are submitted with
current and complete mailing and email addresses for all authors and
co-authors. Also, please keep us updated on any address changes.
____ Electronic Versions: Either a TEX, AMS- TEX, LaTEX, or Word file
for the text of the manuscript is necessary along with a pdf file of
the final version of the article. The digital file (TeX or Word file)
must match the pdf file exactly. Any discrepancies detected between
the two files will cause delays in the publication of the special issue.
____ Abstracts: For consistency, check to make sure all manuscripts
begin with an abstract.
____ Keywords: All papers should include up to five keywords.
____ Figures & Graphs: An electronic version of each figure is
required. Each figure or graph should also appear in the pdf file of
your manuscript.
The preferred format for figures and graphs is PostScript (ps) or
encapsulated PostScript (eps). From with the TEX file of each paper,
we import the eps figures. We will try to work with any electronic
format that we receive. However, this may cause a delay, and at our
discretion, we may require authors to re-submit the illustrations in
ps or eps format, compatible with Adobe Illustrator. Each figure or
graph should be a separate file.
____ References: References should be numbered sequentially in the
order of their appearance in the text, not alphabetically. References
should be cited in the text in square brackets. If the references in
your manuscript are not in this format, you will be asked to redo
them, causing a publication delay for the entire special issue.

Meeting these minimum standards will ensure better quality and faster
publication of your Special Issue. We appreciate your cooperation.

_______________________________________________
Tccc mailing list
Tccc@lists.cs.columbia.edu
https://lists.cs.columbia.edu/cucslists/listinfo/tccc

No comments: