Sincere apologies for cross-posting
*********************************************************
Dear colleagues,
We kindly remind you that there are only a few days left to submit your
papers to IEEE ISWPC 2010 (www.iswpc.org/2010) and we do look forward
to receiving your contributions.
Maria Luisa Merani
IEEE General Chair
On behalf of IEEE ISWPC 2010 Organizing Committee
********************************************************
CALL FOR PAPERS
IEEE International Symposium on Wireless Pervasive Computing
IEEE ISWPC 2010
May 5-7, 2010 - Modena, Italy
http://www.iswpc.org/2010/
*Technical chair*
Mario Gerla, IEEE Fellow
*Keynote speakers*
Muriel Medard, MIT, USA, IEEE Fellow
Keith Ross, New York University, USA, IEEE Fellow
*Tutorials*
Radia Perlman, Sun Microsystems Laboratories, IEEE Fellow
Luca Delgrossi, Mercedes-Benz Research & Development North
America, Inc.
*********************************************************
Call For Papers
Prospective authors are invited to submit original technical papers for
presentation at the conference via EDAS through the following short
link: http://edas.info/N8399.
The maximum length of each manuscript
is six pages. All accepted papers will be published on IEEE Xplore.
Contributions are sought in (but not limited to) the following areas:
- Wireless peer-to-peer
- Wireless mesh networks
- Inter and intra vehicular communications
- Wireless sensor networks
- Green pervasive computing
- Advanced localization and tracking techniques
- Wireless video and multimedia
- Pervasive computing applications
- QoE in wireless systems
- Wireless security
- Cross-layer design
- Wireless routing
- Wireless network coding
- Ad-hoc networks
- Relay assisted and cooperative communications
- Cognitive radio
- UWB
- Propagation and channel characterization
- MIMO and multi-antenna communications
- Smart antennas
- CDMA, TDMA and FDMA air interface
- Wireless access techniques
- WPANs and WLANs
- OFDM, OFDMA
- Wi-MaX
- UMTS and LTE
- Game theory in wireless networks
- Emergency networks
Venue
The 2010 edition of IEEE ISWPC will take place in Modena, Italy. Modena is a
historical city in northern Italy, renowned for its past, witnessed
by the medieval cathedral and the civic tower, declared Unesco World
Heritage. A major city highlight is the 17th century Estense
duke palace, headquarter of the oldest European military academy,
where the conference will be located. Future is running fast in
Modena, home in the present days of the only factory where Ferrari, the
dream car known worldwide, is manufactured. Tradition and cutting edge
innovation daily blend in Modena, and invite you to experience it, being
part of the 2010 IEEE ISWPC event.
IMPORTANT DATES:
Submission deadline (full paper): February 8, 2010
Acceptance notification: March 1, 2010
Final camera ready copy: March 25, 2010
General Chair
Maria Luisa Merani, University of Modena and Reggio Emilia, Italy
Technical chair
Mario Gerla, UCLA, USA
Technical co-chairs
Ekram Hossain, University of Manitoba, Canada
Ilenia Tinnirello, University of Palermo, Italy
Panel chair
Giuseppe Bianchi, University of Roma Tor Vergata, Italy
Tutorial chair
Rajeev Shorey, NIIT University, India
Finance chair
Giovanni Giambene, University of Siena, Italy
Web chair
Daniela Saladino, University of Modena and Reggio Emilia, Italy
Publication chair
Fabrizio Pancaldi, University of Modena and Reggio Emilia, Italy
********************************************************
Maria Luisa Merani
D.I.I. Dipartimento di Ingegneria dell'Informazione
Universita' degli Studi di Modena e Reggio Emilia
Via Vignolese, 905
41125 Modena
tel. +39 059 205-6166
fax +39 059 205-6329
Skype: maria.luisa.merani
<http://dii.ing.unimo.it/~merani/>http<http://dii.ing.unimo.it/~merani/>://dii.ing.unimo.it/~merani/
e-mail: marialuisa.merani@unimore.it
_______________________________________________
Tccc mailing list
Tccc@lists.cs.columbia.edu
https://lists.cs.columbia.edu/cucslists/listinfo/tccc
Posts
No comments:
Post a Comment