Call for Papers
Special issue on: Telecommunications Software Engineering: Emerging
Methods, Models and Tools
Telecommunications software engineering involves the application of
engineering methods in the development of telecommunications software
through the usage of systematic and disciplined qualitative and
quantitative studies. Software engineering, as such, is amongst the
younger generation engineering disciplines, which is still far from
reaching the stage of maturity. Software processes are more complex than
traditional manufacturing processes and are very poorly understood.
Telecommunication systems are very complex and the application of not so
well development software engineering processes for the development of
these systems adds to the complexity. Lots of works are undertaken
worldwide on telecommunications software engineering. As new and
attractive telecommunications technologies emerge every year, new software
engineering methods, models and tools are required for supporting the
development and the maintenance of the increasingly complex systems. This
Special Issue will dedicate to cataloguing excellent works on all phases
of telecommunication systems software development including requirements,
design, development, testing, maintenance, supporting algorithms and
protocols. Telecommunication topics of interest include, but are not
limited to:
• Optical communication systems
• Cellular communication systems
• Broadband wireless access systems
• Wireless Internet
• Software defined radio
• Bluetooth technology
• Ultra-wide band radio
• Emerging Ad Hoc and Sensor Networks
• Wireless Mesh Networks
• IEEE 802.11/802.20/802.22
• Emerging issues in 3G and 4G wireless networks
• Multimedia over emerging wireless networks
• Underwater sensor networks
• Very low-powered sensors
• Cooperative wireless communications
• Multi-hop relay wireless communications
• Emerging wireless network security issues
• Wireless telemedicine and e-health
Guest Editor:
Isaac Woungang
Department of Computer Science
Ryerson University
Toronto, Ontario, Canada.
E-mail: iwoungan@scs.ryerson.ca
Submission Details:
Original, high quality contributions that are not yet published or that
are not currently under review by other journals or peer-reviewed
conferences are sought. Manuscripts should be submitted online at
http://ees.elsevier.com/mcm/. Please mention the special issue title in
the covering letter. Until this is done, the paper will not be accepted
for this Special Issue. General instructions for authors can be found at
http://www.elsevier.com/wps/find/journaldescription.cws_home/623/description#description
Contributing authors might also be asked to review some of the papers
submitted to this special issue.
Important Dates:
Manuscript Due: October 15, 2009.
Acceptance Notification: December
31, 2009.
Camera-Ready Final Manuscript Due: February 1,
2010.
Publication Date: TBD
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SPECIAL ISSUE REQUIREMENTS
FOR AUTHORS
Computers and Mathematics with Applications
Mathematical and Computer Modelling
In order to continue the publication of professional quality journals, the
items listed below are the minimum requirements for accepting manuscripts
for Special Issues submitted for publication in Computers and Mathematics
with Applications and Mathematical and Computer Modelling. We ask you to
be sure that your manuscript meets these requirements when it is submitted
to us for typesetting. We will be unable to typeset/format your manuscript
until these requirements are met. We suggest that you use the following as
a checklist before forwarding the issue to us.
Number of manuscripts allowed per Special Issue: Authors should not appear
as co-authors for more than 2 (two) manuscripts (excluding Preface and
Dedication).
Addresses: Please make sure your manuscript has current and complete
addresses for all authors and co-authors. Include email and FAX numbers,
if available, as these are very helpful in any correspondence with the
authors. Also, please keep us updated on any address changes.
Electronic Versions: TEX, AMS- TEX, LaTEX, or Word files for the text of
the manuscript are acceptable. The digital file must match the hard copies
exactly. If any discrepancies are detected you will be asked to supply
matching digital version and hard copy. This will cause a delay in the
publication of this special issue.
Abstracts: Check to make sure all manuscripts begin with an abstract.
Keywords: Five keywords should be provided for your manuscript.
Figures & Graphs: Authors must supply figures and graphs in an electronic
format in addition to hard copies which are original, publication quality,
xerographically reducible and reproducible, approximately twice the
publication size, with labelling that is clear and sufficiently open to
permit the reduction of size. Each figure or graph should be provided on a
separate page, and approximate location in the text should be indicated.
Figure captions or legends, should be provided for all illustrations on a
separate page. Photographs should be sent as glossy prints.
The preferred format for figures and graphs is encapsulated PostScript
(eps). From with the TEX file of each paper, we import the eps figures.
For the fastest publication time, the format should be eps. However, we
also request that authors submit the original file of each figure and
information regarding the software used to create it. We will try to work
with any electronic format that we receive. However, this may cause a
delay, and at our discretion, we may require authors to re-submit the
illustrations in eps format, compatible with Adobe Illustrator. Each
figure or graph should be a separate file.
References: References should be numbered sequentially in the order of
their appearance in the text, not alphabetically. References should be
cited in the text in square brackets. If the references in your manuscript
are not in this format, you will be asked to redo them, causing a
publication delay for the entire special issue.
Copies: Please send 2 SINGLE-SIDED COPIES of your manuscript.
Meeting these minimum standards will ensure better quality and faster
publication of the Special Issue. We appreciate your cooperation.
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